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1

Low-Temperature Sintering and Microwave Dielectric Properties of CaMoO4 Ceramics

Hong, Tao, Hu, Yongda, Bao, Shengxiang, Luo, Chuan, Ai, Libo, Jiang, Pengbo, Chen, Jie, Duan, Zongzhi

Journal:

Journal of Electronic Materials

Year:

2019

Language:

english

File:

PDF, 1009 KB

english, 2019

2

[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - The optimization of process parameters based on the orthogonal experiments in wire bonding

Song, Lijie, Bao, Shengxiang, Hu, Yongda, Jiang, Wei, Li, Qiang

Year:

2015

Language:

english

File:

PDF, 1.36 MB

english, 2015

3

Antioxidant and anticancer activities of 8-hydroxypsoralen isolated from wampee [Clausena lansium (Lour.) Skeels] peel

K. Nagendra Prasad, Haihui Xie, Jing Hao, Bao Yang, Shengxiang Qiu, Xiaoyi Wei, Fang Chen, Yueming Jiang

Journal:

Year:

2010

Language:

english

File:

PDF, 279 KB

english, 2010

4

Enhanced magnetic and dielectric properties of Bi0.7Y0.2Ba0.1Fe0.98−xCoxO3 ceramic with Co3+ substitution

Li, Qiang, Bao, Shengxiang, Li, Yuanxun, Jing, Yulan, Li, Jie

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2016

Language:

english

File:

PDF, 978 KB

english, 2016

5

Effects on dielectric and magnetic properties of Cr-doped Bi0.9Ba0.1Fe1−xCrxO3 ceramic

Li, Qiang, Bao, Shengxiang, Li, Yuanxun, Song, Lijie, Jiang, Wei, Hu, Yongda

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2015

Language:

english

File:

PDF, 1.01 MB

english, 2015

6

[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Application of orthogonal experiment method of copper samples of small size in Energy Dispersive spectroscopy quantitative analysis

Wang, Xueke, Bao, Shengxiang, Hu, Yongda, Li, Qiang, Ai, Libo

Year:

2016

Language:

english

File:

PDF, 1.13 MB

english, 2016

7

Tunable dielectric resonance with negative permittivity behavior of BiFeO 3 -Bi 2 Fe 4 O 9 composite at about 1 GHz

Li, Qiang, Bao, Shengxiang, Sun, Yanhua, Li, Jie, Yu, Zheyin, Li, Yingfei, Zhang, Shujun, Liu, Yingli, Cheng, Zhenxiang

Journal:

Journal of Alloys and Compounds

Year:

2017

Language:

english

File:

PDF, 7.53 MB

english, 2017

8

[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - Failure analysis of the winding inductor caused by hot dip coating tin

Zheng, Yuwei, Bao, Shengxiang, Rao, Zhenzhen, Zhang, Chengshi, Yan, Yao

Year:

2014

Language:

english

File:

PDF, 560 KB

english, 2014

9

Affinity purification of metalloprotease from marine bacterium using immobilized metal affinity chromatography

Li, Shangyong, Wang, Linna, Yang, Juan, Bao, Jing, Liu, Junzhong, Lin, Shengxiang, Hao, Jianhua, Sun, Mi

Journal:

Journal of Separation Science

Year:

2016

Language:

english

File:

PDF, 785 KB

english, 2016

10

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Analysis of laser typing spots at gold-plated kovar alloy cavity

Zheng, Yuwei, Bao, Shengxiang, Rao, Zhenzhen, Zhang, Chengshi, Yan, Yao

Year:

2014

Language:

english

File:

PDF, 509 KB

english, 2014

11

Effect of particle-size selectivity on quantitative X-ray dark-field computed tomography using a grating interferometer

Bao, Yuan, Shao, Qigang, Hu, Renfang, Wang, Shengxiang, Gao, Kun, Wang, Yan, Tian, Yangchao, Zhu, Peiping

Journal:

Radiation Physics and Chemistry

Year:

2016

Language:

english

File:

PDF, 696 KB

english, 2016

12

Influence of lightly Sm-substitution on crystal structure, magnetic and dielectric properties of BiFeO3 ceramics

Li, Qiang, Bao, Shengxiang, Liu, Yingli, Li, Yuanxun, Jing, Yulan, Li, Jie

Journal:

Journal of Alloys and Compounds

Year:

2016

Language:

english

File:

PDF, 1.44 MB

english, 2016

13

Biomimetic Total Syntheses of Sanctis A–B with Structure Revision

Huo, Luqiong, Dong, Chunmao, Wang, Miaomiao, Lu, Xiuxiang, Zhang, Wenge, Yang, Bao, Yuan, Yunfei, Qiu, Shengxiang, Liu, Hongxin, Tan, Haibo

Journal:

Organic Letters

Year:

2020

Language:

english

File:

PDF, 1.15 MB

english, 2020

14

[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Failure analysis of halide of epoxy molding compound used for electronic packing

Ye, Jianhai, Bao, Shengxiang, Ma, Lili, Lv, Dechun

Year:

2009

Language:

english

File:

PDF, 712 KB

english, 2009

15

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Failure analysis of electroplating on sliver termination in multilayer ceramic capacitors (MLCCs)

Gui, Long, Bao, Shengxiang, Zhang, Xiaowen, Wang, Zuwen, Zhang, Chengshi, Shi, Guanghua

Year:

2012

Language:

english

File:

PDF, 1.29 MB

english, 2012

16

Microwave dielectric properties of low-temperature-fired MgNb 2 O 6 ceramics for LTCC applications

Wu, Chenghao, Hu, Yongda, Bao, Shengxiang, Wang, Gang, Jiang, Pengbo, Chen, Jie, Duan, Zongzhi, Deng, Wenhui

Journal:

Year:

2020

File:

PDF, 1.15 MB

2020

17

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Discoloration mechanism of silver-filled adhesive used for packaging solder joint

Rao, Zhenzhen, Bao, Shengxiang, Lai, Weiming, Shi, Guanghua, Li, Peng, Ye, Jianhai

Year:

2011

Language:

english

File:

PDF, 1.68 MB

english, 2011

18

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Leakage failure analysis of nickel-copper gas-proof material used in traveling-wave tube

Zhang, Chengshi, Bao, Shengxiang, Zhang, Xiaowen, Wang, Zuwen, Li, Peng, Gui, Long

Year:

2012

Language:

english

File:

PDF, 1.34 MB

english, 2012

19

Geologic characteristics of hydrocarbon-bearing marine, transitional and lacustrine shales in China

Jiang, Shu, Xu, Zhengyu, Feng, Youliang, Zhang, Jinchuan, Cai, Dongsheng, Chen, Lei, Wu, Yue, Zhou, Dongsheng, Bao, Shujing, Long, Shengxiang

Journal:

Journal of Asian Earth Sciences

Year:

2016

Language:

english

File:

PDF, 4.79 MB

english, 2016

20

[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Influence of Li-doping on phase structure and magneto-dielectric behaviors in BiFeO3

Li, Qiang, Bao, Shengxiang, Liu, Yingli, Hu, Yongda, Jing, Yulan, Li, Jie, Ai, Libo, Wang, Xueke

Year:

2016

Language:

english

File:

PDF, 700 KB

english, 2016

21

[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Gallium arsenide power amplifier failure analysis

Jiang, Pengbo, Chen, Jie, Hong, Tao, Hu, Yongda, Li, Qiang, Luo, Chuan, Bao, Shengxiang, Duan, Zongzhi, Liu, Huan

Year:

2018

Language:

english

File:

PDF, 5.15 MB

english, 2018

22

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Welding failure analysis of tungsten-copper composite material used for microwave circuits

Ye Jianhai,, Bao Shengxiang,, Ma Lili,, Shi Guanghua,, Li Peng,

Year:

2010

Language:

english

File:

PDF, 1.92 MB

english, 2010

23

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Failure analysis of Sm2Co17 type permanent magnet for high temperature

Yao, Yan, Bao, Shengxiang, Xiaowen, Zhang, Zuwen, Wang, Anguo, Shen, Ming, Zhang

Year:

2014

Language:

english

File:

PDF, 577 KB

english, 2014

24

Combination of corrections for absorption, overlap and background in XRF spectrometry

Journal:

X-Ray Spectrometry

Year:

1999

Language:

english

File:

PDF, 53 KB

english, 1999

25

Sex-Specific Parental Care Strategies Via Nestling Age: Females Pay More Attention to Nestling Demands than Males Do in the Horned Lark, Eremophila alpestris

Liu, Chang-Jing, Du, Bo, Liu, Nai-Fa, Bao, Shi-Jie, Zhang, Shengxiang

Journal:

Zoological Science

Year:

2014

Language:

english

File:

PDF, 180 KB

english, 2014

26

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Research on strength descent of wire bonding in the packing

Dezheng, Zhang, Shengxiang, Bao, Lili, Ma, Dechun, Lv

Year:

2009

Language:

english

File:

PDF, 628 KB

english, 2009

27

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Failure analysis of the winding inductor caused by hot dip coating tin

Zheng, Yuwei, Bao, Shengxiang, Rao, Zhenzhen, Zhang, Chengshi, Yan, Yao

Year:

2014

Language:

english

File:

PDF, 560 KB

english, 2014

28

[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Analysis of decline of silicon-aluminum alloy cavity air tightness

Cui, Yongqiang, Hu, Yongda, Bao, Shengxiang, Jiang, Wei, Luo, Chuan, Song, Lijie, Li, Qiang

Year:

2016

Language:

english

File:

PDF, 652 KB

english, 2016

29

Biomimetic-Inspired Syntheses of Myrtucommuacetalone and Myrtucommulone J

Liu, Hongxin, Huo, Luqiong, Yang, Bao, Yuan, Yunfei, Zhang, Weimin, Xu, Zhifang, Qiu, Shengxiang, Tan, Haibo

Journal:

Organic Letters

Year:

2017

Language:

english

File:

PDF, 1.27 MB

english, 2017

30

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Investigation on electromigration failure of phase shifter

Rao, Zhenzhen, Bao, Shengxiang, Zhang, Xiaowen, Wang, Zuwen, Lai, Weiming

Year:

2012

Language:

english

File:

PDF, 966 KB

english, 2012

31

[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Analysis on the causes of decline of MLCC insulation resistance

Jiang, Wei, Hu, YongDa, Bao, ShengXiang, Lijie, Song, Yuwei, Zheng, Cui, Yongqiang, Qiang, Li

Year:

2015

Language:

english

File:

PDF, 2.46 MB

english, 2015

32

[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - Effect of magnetism of specimen on energy spectrum analysis

Yao, Yan, Bao, Shengxiang, Yuwei, Zheng

Year:

2014

Language:

english

File:

PDF, 288 KB

english, 2014

33

[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - A low loss of Y-doped BiFeO3 ceramics and its magnetic and dielectric properties

Li, Qiang, Bao, Shengxiang, Li, Jie, Hong, Tao, Ai, Libo, Hu, Yongda, Sun, Yanhua

Year:

2017

Language:

english

File:

PDF, 7.72 MB

english, 2017

34

Application of XRD and its computer simulation in analysis of color band defect in BGO crystal

Limei, Rong, Shengxiang, Bao, Yonggong, Ning

Journal:

Year:

2001

Language:

english

File:

PDF, 426 KB

english, 2001

35

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Investigation on soldering reliability in terminal electrodes of MLCC

Shi, GuangHua, Bao, ShengXiang, Li, Peng, Lai, Weiming, Rao, Zhenzhen

Year:

2011

Language:

english

File:

PDF, 3.15 MB

english, 2011

36

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Investigation of electromigration in copper interconnection of ULSI

Dechun Lu,, Shengxiang Bao,, Lili Ma,, Zhibo Du,

Year:

2008

Language:

english

File:

PDF, 228 KB

english, 2008

37

[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Effects of long-term high temperature services on surface micro-structures and components of Sm2Co17 magnets with Ni-coating

Ai, Libo, Bao, Shengxiang, Hu, Yongda, Li, Qiang, Song, Lijie, Wang, Xueke, Cui, Yongqiang, Luo, Chuan, Jiang, Wei

Year:

2016

Language:

english

File:

PDF, 985 KB

english, 2016

38

[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Analysis of copper plating layer discoloration caused by petal-shaped clusters morphology

Zheng, Yuwei, Bao, Shengxiang, Rao, Zhenzhen, Zhang, Chengshi, Yan, Yao

Year:

2015

Language:

english

File:

PDF, 2.13 MB

english, 2015

39

[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Effects of impurities and grain size on welding performance of T3 copper

Wang, Xueke, Bao, Shengxiang, Hu, Yongda, Li, Qiang, Ai, Libo

Year:

2016

Language:

english

File:

PDF, 519 KB

english, 2016

40

[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - One failure analysis of voltage stabilizing circuit

Luo, Chuan, Hu, Yongda, Bao, Shengxiang, Cui, Yongqiang

Year:

2016

Language:

english

File:

PDF, 1.78 MB

english, 2016

41

A Bioinspired Cascade Sequence Enables Facile Assembly of Methanodibenzo[ b , f ][1,5]dioxocin Flavonoid Scaffold

Liu, Hongxin, Wang, Yu, Guo, Xueying, Huo, Luqiong, Xu, Zhifang, Zhang, Weimin, Qiu, Shengxiang, Yang, Bao, Tan, Haibo

Journal:

Organic Letters

Year:

2018

Language:

english

File:

PDF, 956 KB

english, 2018

42

Three-dimensional study of poly(lactic co-glycolic acid) micro-porous microspheres using hard X-ray nano-tomography

Wang, Dajiang, Li, Na, Wang, Zhili, Gao, Kun, Zhang, Yongming, Luo, Yuyan, Wang, Shengxiang, Bao, Yuan, Shao, Qigang, Wu, Ziyu

Journal:

Journal of Synchrotron Radiation

Year:

2014

Language:

english

File:

PDF, 542 KB

english, 2014

43

[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Application of C-mode Scanning Acoustic Microscopy in Packaging

Ma, Lili, Bao, Shengxiang, Lv, Dechun, Du, Zhibo, Li, Shilan

Year:

2007

Language:

english

File:

PDF, 3.34 MB

english, 2007

44

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Investigation on surface contamination caused by human on phase shifter chip

Rao, Zhenzhen, Bao, Shengxiang, Ye, Jianhai, Zhang, Xiaowen, Wang, Zuwen

Year:

2012

Language:

english

File:

PDF, 1.04 MB

english, 2012

45

Investigation of domain retention behaviors of La3+-doped SrBi2Ta2O9 thin films

Linshan Dai, Shengxiang Bao, Huizhong Zeng, Jingsong Liu

Journal:

Materials Letters

Year:

2005

Language:

english

File:

PDF, 321 KB

english, 2005

46

Electron Beam Induced Growth of Silver Nanoparticles

Guanghua Shi, Shengxiang Bao, Weiming Lai, Zhenzhen Rao, Xiaowen Zhang, Zuwen Wang

Journal:

Year:

2012

Language:

english

File:

PDF, 851 KB

english, 2012

47

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Effect of magnetism of specimen on energy spectrum analysis

Yao, Yan, Bao, Shengxiang, Yuwei, Zheng

Year:

2014

Language:

english

File:

PDF, 288 KB

english, 2014

48

Abnormal Metabolic Connectivity in Rats at the Acute Stage of Ischemic Stroke

Liang, Shengxiang, Jiang, Xiaofeng, Zhang, Qingqing, Duan, Shaofeng, Zhang, Tianhao, Huang, Qi, Sun, Xi, Liu, Hua, Dong, Jie, Liu, Weilin, Tao, Jing, Zhao, Shujun, Nie, Binbin, Chen, Lidian, Shan, Bao

Journal:

Neuroscience Bulletin

Year:

2018

Language:

english

File:

PDF, 3.78 MB

english, 2018

49

[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - Failure Analysis of In/Au Solder Joints

Ma, Lili, Bao, Shengxiang, Peng, Jing, Du, Zhibo

Year:

2006

Language:

english

File:

PDF, 3.74 MB

english, 2006

50

A novel microwave dielectric ceramic Li 2 NiZrO 4 with rock salt structure

Jiang, Pengbo, Hu, Yongda, Bao, Shengxiang, Chen, Jie, Duan, Zongzhi, Hong, Tao, Wu, ChengHao, Wang, Gang

Journal:

Year:

2019

File:

PDF, 617 KB

2019

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